1 aos semiconductor product reliability report AOZ8001KIL , rev a plasti c encapsulate d device alph a & omeg a semiconductor , inc 495 mercury drive sunnyvale, ca 94085 u.s. tel : (408 ) 830 - 974 2 www.aosmd.com
2 this aos product reliability report summarizes the qualification result for AOZ8001KIL. review of the electrical test results confirm that AOZ8001KIL pass aos quality and reliability requirements for product release. the continuous qualification testing and reliabili ty monitoring program ensure that all outgoing products will continue to meet aos quality and reliability standards. table of contents: i. product description ii. package and die information iii. qualification test requirements iv. qualification tests result v. reliability evaluation i. product description: the AOZ8001KIL is a transient voltage suppressor ar ray to protect high speed data lines from esd and lightning. . absolute maximum ratings parameter vp-vn 6v peak pulse current (ipp), tp=8/20us 5a storage temperature (t s ) -65c to +150c esd rating per iec61000-4-2, contact (1) 8kv esd rating per iec61000-4-2, air (2) 15kv esd rating per human body model (2) 15kv junction temperature (t j ) -40c to +85c notes: (1) iec-61000-4-2 discharge with c discharge =150pf, r discharge =330 (2) human body discharge per mil-std-883, method 30 15 c discharge =100pf, r discharge =1.5k ii. package and die information: product id AOZ8001KIL process hhnec hv003a1 package type sc89a lead frame cu die attach material 8006ns die bond wire au , 1 mil mold material e670cb msl level up to level 1
3 iii. qualification tests requirements 2 lots of AOZ8001KIL up to 500 hrs of htol for new product release. 3 lots of package qual testing (pct, 500 cycles tc, h ast) for package release to manufacturing. iv. qualification tests result test item test condition sample size result comment pre- conditioning per jesd 22-a113 168hrs @85 c /85%rh+3 cyc reflow@260c 3 lots pass htol per jesd 22-a108_b vdd= 6v temp = 125c 2 lots (80 /lot) pass temperature cycle '-65 c to +150 c, air to air (2cyc/hr) 3 lots (82 /lot) pass pressure pot 121c, 29.7psi, rh= 100% 3 lots (82 /lot) pass hast '130 +/- 2c, 85%rh, 33.3 psi, at vcc min power dissipation. 3 lots (60 /lot) pass esd rating per iec-61000-4-2, contact 3 lots (5 /lot) pass 8kv contact esd rating per iec-61000-4-2, air discharge 3 lots (5 /lot) pass 15kv contact lightning surge rating per iec-61000-4-5 3 lots (5 /lot) pass 5a surge the qualification test results confirm that AOZ8001KIL pass aos quality and reliability requirements for product release.
4 v. reliability evaluation fit rate (per billion): 44 mttf = 2575 years the presentation of fit rate for the individual pro duct reliability is restricted by the actual burn-i n sample size of the selected product. failure rate determination is bas ed on jedec standard jesd 85. fit means one failure per billion device hours. failure rate = chi 2 x 10 9 / [ 2 (n) (h) (af) ] = 1.83 x 10 9 / [ 2x2x80x500x258 ] = 44 mttf = 10 9 / fit =2.26 x10 7 hrs= 2575 years chi2 = chi squared distribution, determined by the numbe r of failures and confidence interval n = total number of units from htrb and htgb tests h = duration of htrb/htgb testing af = acceleration factor from test to use conditions ( ea = 0.7ev and tuse = 55c) acceleration factor [ af ] = exp [ea / k (1/tj u C 1/tj s)] acceleration factor ratio list: 55 deg c 70 deg c 85 deg c 100 deg c 115 deg c 130 deg c 150 deg c af 258 87 32 13 5.64 2.59 1 tj s = stressed junction temperature in degree (kelvin), k = c+273.16 tj u =the use junction temperature in degree (kelvin), k = c+273.16 k = boltzmanns constant, 8.617164 x 10 -5 ev / k
|
